



特性
●5mm/3mm/假贴片式, DIP插件封装型式;
●高速讯号响应;
●暗电流值低;
●连接电容值小;
应用
●工业用设备;
●其他红外线应用系统;
product | Size(mm) | IL_Typ(μA) | Rise /Fall Time(ns) | BVR_Min.(V) | ID_Max(nA) | λp(nm) | |
HL-508GD05-QB | 5mm | 70 | 50 | 35 | 100 | 400~1100 | |
HL-500ED06-P2 | 5mm | 30 | 50 | 30 | 30 | 850~940 | |
HL-508GC05-QB | 5mm | 70 | 50 | 35 | 100 | 850~940 | |
HL-508GC05-QF | 5mm | 80 | 50 | 35 | 100 | 400~1100 | |
| HL-507GD05-QB | 5mm | 80 | 50 | 35 | 100 | 850~940 | |
| HL-508GD05-QE | 5mm | 30 | 50 | 35 | 30 | 850~940 | |